Min Miao

Orcid: 0000-0001-8205-6419

According to our database1, Min Miao authored at least 20 papers between 2009 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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On csauthors.net:

Bibliography

2024
L-ENet: An Ultralightweight SAR Image Detection Network.
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens., 2024

SCNet: A Lightweight and Efficient Object Detection Network for Remote Sensing.
IEEE Geosci. Remote. Sens. Lett., 2024

2023
A PAM4 transceiver design scheme with threshold adaptive and tap adaptive.
EURASIP J. Adv. Signal Process., December, 2023

A physics-based modeling method of THz Schottky diode for circuit simulation.
Microelectron. J., 2023

2022
A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging.
Microelectron. J., 2022

TSV Defects Classification with Machine Learning Approaches.
Proceedings of the 2022 IEEE International Conference on Integrated Circuits, 2022

Design of 20Gb/s PAM4 Transmitter with 2-tap FFE.
Proceedings of the 15th International Congress on Image and Signal Processing, 2022

2021
Design of EMI and suppression structure based on bar-via.
Microelectron. J., 2021

Compact Modeling and Analysis of a Typical Inter-Chiplet Serial High Speed Link on an Active Interposer.
Proceedings of the 2021 IEEE International Conference on Integrated Circuits, 2021

2020
Parallel Coding Scheme With Turbo Product Code for Mobile Multimedia Transmission in MIMO-FBMC System.
IEEE Access, 2020

2018
Onboard Spectral and Spatial Cloud Detection for Hyperspectral Remote Sensing Images.
Remote. Sens., 2018

On Continuous Speech Recognition of Indian English.
Proceedings of the 2018 International Conference on Algorithms, 2018

2017
An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias.
IEEE Trans. Very Large Scale Integr. Syst., 2017

2013
Electrical characterization of integrated passive devices using thin film technology for 3D integration.
J. Zhejiang Univ. Sci. C, 2013

Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration.
Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging.
Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

2012
A 3D micro-channel cooling system embedded in LTCC packaging substrate.
Proceedings of the 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2012

2011
A novel LTCC capacitive accelerometer embedded in LTCC packaging substrate.
Proceedings of the 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2011

2010
A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge.
Proceedings of the 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2010

2009
Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration.
Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009


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