Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration. - Min Miao; Yufeng Jin; Hongguang Liao; Liwei Zhao; Yunhui Zhu; Xin Sun 003; Yunxia Guo (NEMS, 2009)

A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge. - Min Miao; Jing Zhang; Yunsong Qiu; Yangfei Zhang; Yufeng Jin; Hua Gan (NEMS, 2010)

A novel LTCC capacitive accelerometer embedded in LTCC packaging substrate. - Hua Gan; Yufeng Jin; Min Miao; Xin Sun 003 (NEMS, 2011)

A 3D micro-channel cooling system embedded in LTCC packaging substrate. - Songtao Jia; Min Miao; Runiu Fang; Shichao Guo; Duwei Hu; Yufeng Jin (NEMS, 2012)

In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging. - Yichao Xu; Guanjiang Wang; Xin Sun 003; Runiu Fang; Min Miao; Yufeng Jin (NEMS, 2013)

Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration. - Zhiyuan Zhu; Shaonan Wang; Yichao Xu; Guanjiang Wang; Yudan Pi; Peiquan Wang; Yunhui Zhu; Xin Sun 003; Min Yu; Jing Chen; Min Miao; Yufeng Jin (NEMS, 2013)

Electrical characterization of integrated passive devices using thin film technology for 3D integration. - Xin Sun 003; Yunhui Zhu; Zhen Hua Liu; Qing-hu Cui; Shenglin Ma; Jing Chen; Min Miao; Yufeng Jin (J. Zhejiang Univ. Sci. C, 2013)

An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias. - Xiaole Cui; Xiaoxin Cui; Yewen Ni; Min Miao; Yufeng Jin (IEEE Trans. Very Large Scale Integr. Syst., 2017)

On Continuous Speech Recognition of Indian English. - Xin Jin; Keliang Zhang; Xian Huang; Min Miao (ACAI, 2018)

Onboard Spectral and Spatial Cloud Detection for Hyperspectral Remote Sensing Images. - Haoyang Li; Hong Zheng; Chuanzhao Han; Haibo Wang; Min Miao (Remote. Sens., 2018)

Parallel Coding Scheme With Turbo Product Code for Mobile Multimedia Transmission in MIMO-FBMC System. - Zhensong Li; Min Miao; Zhuwei Wang (IEEE Access, 2020)

Compact Modeling and Analysis of a Typical Inter-Chiplet Serial High Speed Link on an Active Interposer. - Zhuanzhuan Zhang; Min Miao; Xiaolong Duan (ICTA, 2021)

Design of EMI and suppression structure based on bar-via. - Na Li; Min Miao (Microelectron. J., 2021)

Design of 20Gb/s PAM4 Transmitter with 2-tap FFE. - Xuena Liu; Zhensong Li; Hao Wen; Min Miao (CISP-BMEI, 2022)

TSV Defects Classification with Machine Learning Approaches. - Haitao He; Changhao Luo; Junchen Dong; Yudi Zhao; Min Miao; Kai Zhao (ICTA, 2022)

A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging. - Min Miao; Danya Zhang; Xin Nie; Jingpeng Bu (Microelectron. J., 2022)

A physics-based modeling method of THz Schottky diode for circuit simulation. - Weiheng Zhao; Yudi Zhao; Min Miao (Microelectron. J., 2023)

A PAM4 transceiver design scheme with threshold adaptive and tap adaptive. - Xuena Liu; Zhensong Li; Hao Wen; Min Miao; Yuduo Wang; Zhuwei Wang (EURASIP J. Adv. Signal Process., 2023)

SCNet: A Lightweight and Efficient Object Detection Network for Remote Sensing. - Shiliang Zhu; Min Miao (IEEE Geosci. Remote. Sens. Lett., 2024)

L-ENet: An Ultralightweight SAR Image Detection Network. - Yutong Wang; Min Miao; Shiliang Zhu (IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens., 2024)