Yunhui Zhu

According to our database1, Yunhui Zhu authored at least 15 papers between 2009 and 2023.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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Links

On csauthors.net:

Bibliography

2023
Graph Neural Networks for Missing Value Classification in a Task-Driven Metric Space.
IEEE Trans. Knowl. Data Eng., August, 2023

2022
Adaptive Polygon Generation Algorithm for Automatic Building Extraction.
IEEE Trans. Geosci. Remote. Sens., 2022

Level-wise Dynamic Label Assignment for Oriented Object Detection.
Proceedings of the IEEE Symposium Series on Computational Intelligence, 2022

Conditional Inpainting Generative Flow.
Proceedings of the IEEE Symposium Series on Computational Intelligence, 2022

Hiding Among Your Neighbors: Face Image Privacy Protection with Differential Private k-anonymity.
Proceedings of the IEEE International Symposium on Broadband Multimedia Systems and Broadcasting, 2022

2021
Semi-supervised Learning with Missing Values Imputation.
CoRR, 2021

2020
A Hybrid Model for Natural Face De-Identiation with Adjustable Privacy.
Proceedings of the 2020 IEEE International Conference on Visual Communications and Image Processing, 2020

Deep Learning-based Low-dose Tomography Reconstruction with Hybrid-dose Measurements.
Proceedings of the 6th IEEE/ACM Workshop on Machine Learning in High Performance Computing Environments, 2020

User Behavioral Preference Analysis Based on Location Information.
Proceedings of the 16th International Wireless Communications and Mobile Computing Conference, 2020

2019
Robust X-ray Sparse-view Phase Tomography via Hierarchical Synthesis Convolutional Neural Networks.
CoRR, 2019

2018
A Multi-Mode Visual Recognition Hardware Accelerator for AR/MR Glasses.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2018

2015
Low temperature multi-layer wafer level package for chip scale atomic clock (CSAC).
Proceedings of the 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2015

2013
Electrical characterization of integrated passive devices using thin film technology for 3D integration.
J. Zhejiang Univ. Sci. C, 2013

Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration.
Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

2009
Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration.
Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009


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