Tong An

According to our database, Tong An authored at least 12 papers between 2005 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

A Security Resilience Metric Framework Based on the Evolution of Attack and Defense Scenarios.

Jinxin Zuo, Ziyu Guo, Tong An, Zhongwei Xu, Yueming Lu

IEEE Internet Things J., October, 2023

Dual-mode active noise control system with on-line identification of secondary path.

Tao Zhang, Tong An, Yanzhang Geng, Zhongzheng Liu, Xin Zhao, Shuang Li

Multim. Tools Appl., September, 2023

2022

New Generation Power System Security Protection Technology Based on Dynamic Defense.

Xiaowei Chen, HeFang Jiang, Shaocheng Wu, Tao Liu, Tong An, Zhongwei Xu, Man Zhang, Muhammad Shafiq

Proceedings of the Artificial Intelligence and Security - 8th International Conference, 2022

2021

Normalized Combinations of Proportionate Affine Projection Sign Subband Adaptive Filter.

Tong An, Tao Zhang, Yanzhang Geng, Hai-Quan Jiao

Sci. Program., 2021

An Experimental Evaluation and Investigation of Waves of Misery in R-trees.

Lu Xing, Eric Lee, Tong An, Bo-Cheng Chu, Ahmed Mahmood, Ahmed M. Aly, Jianguo Wang, Walid G. Aref

Proc. VLDB Endow., 2021

Underwater Wireless High-Efficiency Energy Transmission Method Based on the Ultrasonic Transducer Array.

Zhongzheng Liu, Tao Zhang, Yanzhang Geng, Tong An

Proceedings of the 21st International Conference on Communication Technology, 2021

2018

The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface.

Si Chen, Zhizhe Wang, Yunfei En, Yun Huang, Fei Qin, Tong An

Microelectron. Reliab., 2018

Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests.

Tong An, Chao Fang, Fei Qin, Huaicheng Li, Tao Tang, Pei Chen

Microelectron. Reliab., 2018

2016

Protrusion of electroplated copper filled in through silicon vias during annealing process.

Si Chen, Fei Qin, Tong An, Pei Chen, Bin Xie, Xunqing Shi

Microelectron. Reliab., 2016

2014

Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates.

Tong An, Fei Qin

Microelectron. Reliab., 2014

2011

Mechanical behavior of solder joints under dynamic four-point impact bending.

Tong An, Fei Qin, Jiangang Li

Microelectron. Reliab., 2011

2005

Hamiltonian-like Properties of k-Ary n-Cubes.

Deqiang Wang, Mingyang Pan, Tong An, Kelun Wang, Shuyan Qu

Proceedings of the Sixth International Conference on Parallel and Distributed Computing, 2005