Seungman Choi

Orcid: 0000-0001-7412-7205

According to our database1, Seungman Choi authored at least 11 papers between 2015 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
A Unified Physics-Based Stochastic Model for EM-Induced Resistance Degradation in BEoL Interconnect Segments.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023
Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2023

Nickel Silicide Electromigration on Micro Ring Modulators for Silicon Photonics Technology.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022
Development of Bipolar Electrostatic Chuck with a Beam-Array Assembly Fabricated by Lithography.
Int. J. Autom. Technol., 2022

2021
Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects.
Proceedings of the IEEE International Reliability Physics Symposium, 2021

Heuristic Evaluation for Augmentative and Alternative Communication Application: A Case Study.
Proceedings of the International Conference on Information and Communication Technology Convergence, 2021

2019
Robust BEOL MIMCAP for Long and Controllable TDDB Lifetime.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018
Reliability challenges for 2.5D/3D integration: An overview.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

Effect of metal line width on electromigration of BEOL Cu interconnects.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2015
Impact of electrode surface modulation on time-dependent dielectric breakdown.
Proceedings of the IEEE International Reliability Physics Symposium, 2015


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