J. H. J. Janssen

According to our database, J. H. J. Janssen authored at least 8 papers between 2003 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Thermal-Aware Synthesis of 5G Base Station Antenna Arrays: An Overview and a Sparsity-Based Approach.

Yanki Aslan, Jan Puskely, J. H. J. Janssen, Marcel Geurts, Antoine Roederer, Alexander Yarovoy

IEEE Access, 2018

2008

Thermal heating within SOI.

J. J. Koning, S. Lecaudey, E. Spaan, M. Stoutjesdijk, J. H. J. Janssen

Microelectron. Reliab., 2008

2007

Numerical modeling of warpage induced in QFN array molding process.

Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen

Microelectron. Reliab., 2007

Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.

Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen

Microelectron. Reliab., 2007

Analysis of Cu/low-k bond pad delamination by using a novel failure index.

Marcel A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken

Microelectron. Reliab., 2007

Virtual qualification of moisture induced failures of advanced packages.

Marcel A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen

Microelectron. Reliab., 2007

2004

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods.

Willem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, Marcel A. J. van Gils, Leo J. Ernst

Microelectron. Reliab., 2004

2003

Prediction and verification of process induced warpage of electronic packages.

W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi

Microelectron. Reliab., 2003