Hengchang Bi

According to our database, Hengchang Bi authored at least 5 papers between 2013 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

A Spike-Sorting-Assisted Compressed Sensing Processor for High-Density Neural Interfaces.

Qingzhen Wang, Wenxian Gu, Hengchang Bi, Liangjian Lyu, Deli Qiao, Xing Wu

Proceedings of the 15th IEEE International Conference on ASIC, 2023

2022

Flexible Pressure Sensor Array with Multi-Channel Wireless Readout Chip.

Haohan Wangxu, Liangjian Lyu, Hengchang Bi, Xing Wu

Sensors, 2022

2021

Analog Sensing and Computing Systems with Low Power Consumption for Gesture Recognition.

Tianyi Fan, Zheyu Liu, Zewei Luo, Junda Li, Xiyue Tian, Yeshen Chen, Yuan Feng, Chaolun Wang, Hengchang Bi, Xinming Li, Fei Qiao, Xing Wu

Adv. Intell. Syst., 2021

2013

Fabrication of graphene based electrothermal cantilever actuator.

Yilong Zhou, Hengchang Bi, Xiao Xie, Litao Sun

Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

Low temperature casting of graphene into various 3-D shapes.

Shu Wan, Hengchang Bi, Kuibo Yin, Xiao Xie, Yilong Zhou, Neng Wan, Feng Xu, Litao Sun

Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013