Christian Gontrand
Orcid: 0000-0002-2257-5214
According to our database1,
Christian Gontrand
authored at least 24 papers
between 2002 and 2021.
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Bibliography
2021
On the Investigation of Interface Defects of Solar Cells: Lead-Based vs Lead-Free Perovskite.
IEEE Access, 2021
2020
Electrical modeling of tapered TSV including MOS-Field effect and substrate parasitics: Analysis and application.
Microelectron. J., 2020
Physically Based Analytical Model of Heavily Doped Silicon Wafers Based Proposed Solar Cell Microstructure.
IEEE Access, 2020
2018
Impact of TSV location in HVIC on CMOS operation: A mixed-mode TCAD simulation study.
Microelectron. J., 2018
2016
FPGA-based test bed for measurement of AM/AM and AM/PM distortion and modeling memory effects in RF PAs.
Integr., 2016
Modeling and simulation of a hybrid 3D silicon detector system using SILVACO and Simulink/MATLAB framework.
Proceedings of the 28th International Conference on Microelectronics, 2016
2015
An efficient and simple compact modeling approach for 3-D interconnects with IC's stack global electrical context consideration.
Microelectron. J., 2015
Corrigendum to "Modelling of through silicon via and devices electromagnetic coupling" [Microelectron. J 42 (2011) 316-324].
Microelectron. J., 2015
Modeling memory effects in RF power amplifiers applied to a digital pre-distortion algorithm and emulated on a DSP-FPGA board.
Integr., 2015
Test bed for low-cost measurement of AM/AM and AM/PM effects in RF PAs based on FPGA.
Proceedings of the 25. International Conference on Electronics, 2015
2014
Microelectron. J., 2014
3D substrate modeling; from a first order electrical analysis, towards some possible signal fluctuations consideration, for radio frequency circuits.
Microelectron. J., 2014
Mathematical approach and optimisation of nanometric base thickness for a SiGeC HBT dedicated to radiofrequency applications.
J. Comput. Appl. Math., 2014
Proceedings of the UKSim-AMSS 16th International Conference on Computer Modelling and Simulation, 2014
Measure-based modeling and FPGA implementation of RF Power Amplifier using a multi-layer perceptron neural network.
Proceedings of the 24th International Conference on Electronics, 2014
2012
Numerical modeling of MOS transistor with interconnections using lumped element-FDTD method.
Microelectron. J., 2012
2011
Microelectron. J., 2011
2010
Design of 20 GHz high performance LC-VCOs in a 52 GHz f<sub>T</sub> SiGe: C BiCMOS technology.
Microelectron. J., 2010
2009
Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking.
Proceedings of the IEEE International Conference on 3D System Integration, 2009
2008
2007
Design Considerations for a 20 GHz VCO Using a Cross-Coupled Differential Pair Topology.
Proceedings of the World Congress on Engineering, 2007
2006
IEEE Trans. Circuits Syst. I Regul. Pap., 2006
Microelectron. J., 2006
2002
Proceedings of the Field-Programmable Logic and Applications, 2002