Choong-Un Kim

According to our database1, Choong-Un Kim authored at least 4 papers between 2020 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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PhD thesis 
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Links

On csauthors.net:

Bibliography

2024
Study of Thermomechanical Damage Mechanism in Al Interconnects in Al-SiO2 structure by High Density Peak Current.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023
Advanced Methods of Detecting Physical Damages in Packaging and BEOL Interconnects.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

2021
Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages.
Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020
Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020


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