Zsolt Tokei

According to our database, Zsolt Tokei authored at least 37 papers between 2005 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2024

Ultra-Scaled E-Tree-Based SRAM Design and Optimization With Interconnect Focus.

Zhenlin Pei, Hsiao-Hsuan Liu, Mahta Mayahinia, Mehdi B. Tahoori, Francky Catthoor, Zsolt Tokei, Dawit Burusie Abdi, James Myers, Chenyun Pan

IEEE Trans. Circuits Syst. I Regul. Pap., October, 2024

Mitigating Line-Break Defectivity with a Sandwiched TiN or W Layer for Metal Pitch 18 NM Aspect Ratio 6 Semi-Damascene Interconnects.

Anshul Gupta, Shreya Kundu, Stefan Decoster, K. Sah, G. Delie, B. Truijen, Davide Tierno, Giulio Marti, O. Varela Pedreira, B. Kenens, Y. Hermans, C. Adelmann, B. de Wachter, Ivan Ciofi, G. Murdoch, A. Cross, Seongho Park, Zsolt Tokei

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2023

Integration of a Stacked Contact MOL for Monolithic CFET.

Victor Vega-Gonzalez, D. Radisic, Bt Chan, S. Choudhury, S. Wang, A. Mingardi, Q. Toan Le, H. Decoster, Yusuke Oniki, P. Puttarame, Kevin Vandersmissen, J. P. Soulie, A. Peter, A. Sepulveda, D. Batuk, G. T. Martinez, Olivier Richard, Jürgen Bömmels, S. Biesemans, E. Dentoni Litta, Naoto Horiguchi, Seongho Park, Zsolt Tokei

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Emerging Interconnect Exploration for SRAM Application Using Nonconventional H-Tree and Center-Pin Access.

Zhenlin Pei, Mahta Mayahinia, Hsiao-Hsuan Liu, Mehdi B. Tahoori, Shairfe Muhammad Salahuddin, Francky Catthoor, Zsolt Tokei, Chenyun Pan

Proceedings of the 24th International Symposium on Quality Electronic Design, 2023

Towards accurate temperature prediction in BEOL for reliability assessment (Invited).

Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Technology/Memory Co-Design and Co-Optimization Using E-Tree Interconnect.

Zhenlin Pei, Mahta Mayahinia, Hsiao-Hsuan Liu, Mehdi B. Tahoori, Francky Catthoor, Zsolt Tokei, Chenyun Pan

Proceedings of the Great Lakes Symposium on VLSI 2023, 2023

Electromigration-aware design technology co-optimization for SRAM in advanced technology nodes.

Mahta Mayahinia, Hsiao-Hsuan Liu, Subrat Mishra, Zsolt Tokei, Francky Catthoor, Mehdi B. Tahoori

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2023

2022

First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP.

Gayle Murdoch, Matin O'Toole, Giulio Marti, Ankit Pokhrel, Diana Tsvetanova, Stefan Decoster, Shreya Kundu, Yusuke Oniki, Arame Thiam, Quoc Toan Le, Olalla Varela Pedreira, Alicja Lesniewska, Gerardo Martinez-Alanis, Seongho Park, Zsolt Tokei

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

Logic Scaling Options for the Next 10 Years: From FinFet to CFET, from Dual Damascene to Semi Damascene.

Zsolt Tokei

Proceedings of the FPGA '22: The 2022 ACM/SIGDA International Symposium on Field-Programmable Gate Arrays, Virtual Event, USA, 27 February 2022, 2022

2021

Electromigration limits of copper nano-interconnects.

Houman Zahedmanesh, Olalla Varela Pedreira, Zsolt Tokei, Kristof Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2021

Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps.

Alicja Lesniewska, Olalla Varela Pedreira, Melina Lofrano, Gayle Murdoch, Marleen H. van der Veen, Anish Dangol, Naoto Horiguchi, Zsolt Tökei, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2021

Global Is the New Local: FPGA Architecture at 5nm and Beyond.

Stefan Nikolic, Francky Catthoor, Zsolt Tokei, Paolo Ienne

Proceedings of the FPGA '21: The 2021 ACM/SIGDA International Symposium on Field Programmable Gate Arrays, Virtual Event, USA, February 28, 2021

2020

Metal reliability mechanisms in Ruthenium interconnects.

Olalla Varela Pedreira, Michele Stucchi, Anshul Gupta, Victor Vega-Gonzalez, Marleen van der Veen, Stephane Lariviere, Christopher J. Wilson, Zsolt Tökei, Kristof Croes

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill.

Alicja Lesniewska, Philippe J. Roussel, Davide Tierno, Victor Vega-Gonzalez, Marleen H. van der Veen, Patrick Verdonck, Nicolas Jourdan, Christopher J. Wilson, Zsolt Tökei, Kris Croes

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019

Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch.

Sofie Beyne, Olalla Varela Pedreira, Ingrid De Wolf, Zsolt Tökei, Kristof Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018

Insights into metal drift induced failure in MOL and BEOL.

Chen Wu, O. Varela Pedreira, Alicja Lesniewska, Yunlong Li, Ivan Ciofi, Zsolt Tökei, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2018

Stress mitigation of 3D-stacking/packaging induced stresses.

Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tökei, Eric Beyne

Proceedings of the IEEE International Reliability Physics Symposium, 2018

The first observation of p-type electromigration failure in full ruthenium interconnects.

Sofie Beyne, Shibesh Dutta, Olalla Varela Pedreira, Niels Bosman, Christoph Adelmann, Ingrid De Wolf, Zsolt Tökei, Kristof Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2017

Statistical Timing Analysis Considering Device and Interconnect Variability for BEOL Requirements in the 5-nm Node and Beyond.

Trong Huynh Bao, Julien Ryckaert, Zsolt Tokei, Abdelkarim Mercha, Diederik Verkest, Aaron Voon-Yew Thean, Piet Wambacq

IEEE Trans. Very Large Scale Integr. Syst., 2017

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects.

Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tökei

Microelectron. Reliab., 2017

2016

Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation.

Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tökei

Microelectron. Reliab., 2016

Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.

Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tökei

Microelectron. Reliab., 2016

2015

Technology/circuit co-optimization and benchmarking for graphene interconnects at Sub-10nm technology node.

Chenyun Pan, Praveen Raghavan, Francky Catthoor, Zsolt Tokei, Azad Naeemi

Proceedings of the Sixteenth International Symposium on Quality Electronic Design, 2015

Constant voltage electromigration for advanced BEOL copper interconnects.

Baojun Tang, Kris Croes, Nicolas Jourdan, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf, Eric Wilcox, Timothy McMullen

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Intrinsic reliability of local interconnects for N7 and beyond.

Kris Croes, Alicja Lesniewska, Chen Wu, Ivan Ciofi, Agnieszka Banczerowska, B. Briggs, S. Demuynck, Zsolt Tökei, Jürgen Bömmels, Yves Saad, W. Gao

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Impact of process variability on BEOL TDDB lifetime model assessment.

Kris Croes, Deniz Kocaay, Ivan Ciofi, Jürgen Bömmels, Zsolt Tökei

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Impact of interconnect multiple-patterning variability on SRAMs.

Ioannis Karageorgos, Michele Stucchi, Praveen Raghavan, Julien Ryckaert, Zsolt Tokei, Diederik Verkest, Rogier Baert, Sushil Sakhare, Wim Dehaene

Proceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition, 2015

Holisitic device exploration for 7nm node.

Praveen Raghavan, Marie Garcia Bardon, Doyoung Jang, P. Schuddinck, Dmitry Yakimets, Julien Ryckaert, Abdelkarim Mercha, Naoto Horiguchi, Nadine Collaert, Anda Mocuta, Dan Mocuta, Zsolt Tokei, Diederik Verkest, Aaron Thean, An Steegen

Proceedings of the 2015 IEEE Custom Integrated Circuits Conference, 2015

2014

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling.

Bart Vandevelde, Andrej Ivankovic, B. Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei

Microelectron. Reliab., 2014

As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability.

Baojun Tang, Kris Croes, Yohan Barbarin, Yunqi Wang, Robin Degraeve, Yunlong Li, Maria Toledano-Luque, Thomas Kauerauf, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf

Microelectron. Reliab., 2014

Circuit and process co-design with vertical gate-all-around nanowire FET technology to extend CMOS scaling for 5nm and beyond technologies.

Trong Huynh Bao, Dmitry Yakimets, Julien Ryckaert, Ivan Ciofi, Rogier Baert, Anabela Veloso, Jürgen Bömmels, Nadine Collaert, Philippe Roussel, S. Demuynck, Praveen Raghavan, Abdelkarim Mercha, Zsolt Tokei, Diederik Verkest, Aaron Thean, Piet Wambacq

Proceedings of the 44th European Solid State Device Research Conference, 2014

Design Technology co-optimization for N10.

Julien Ryckaert, Praveen Raghavan, Rogier Baert, Marie Garcia Bardon, Mircea Dusa, Arindam Mallik, Sushil Sakhare, Boris Vandewalle, Piet Wambacq, Bharani Chava, Kris Croes, Morin Dehan, Doyoung Jang, Philippe Leray, Tsung-Te Liu, Kenichi Miyaguchi, Bertrand Parvais, Pieter Schuddinck, Philippe Weemaes, Abdelkarim Mercha, Jürgen Bömmels, Naoto Horiguchi, Greg McIntyre, Aaron Thean, Zsolt Tökei, Shaunee Cheng, Diederik Verkest, An Steegen

Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, 2014

2008

Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle.

Kristof Croes, G. Cannatá, L. Zhao, Zsolt Tökei

Microelectron. Reliab., 2008

A tool flow for predicting system level timing failures due to interconnect reliability degradation.

Jin Guo, Antonis Papanikolaou, Michele Stucchi, Kristof Croes, Zsolt Tokei, Francky Catthoor

Proceedings of the 18th ACM Great Lakes Symposium on VLSI 2008, 2008

2006

Reliability issues in deep deep sub-micron technologies: time-dependent variability and its impact on embedded system design.

Antonis Papanikolaou, Miguel Miranda, Hua Wang, Francky Catthoor, M. Satyakiran, Pol Marchal, Ben Kaczer, C. Bruynseraede, Zsolt Tokei

Proceedings of the IFIP VLSI-SoC 2006, 2006

2005

Reliability challenges for copper low-k dielectrics and copper diffusion barriers.

Zsolt Tökei, Yunlong Li, G. P. Beyer

Microelectron. Reliab., 2005

Layout dependency induced deviation from Poisson area scaling in BEOL dielectric reliability.

Yunlong Li, Zsolt Tökei, Philippe Roussel, Guido Groeseneken, Karen Maex

Microelectron. Reliab., 2005