Zhongchen Bai

Orcid: 0000-0002-0286-4246

According to our database1, Zhongchen Bai authored at least 3 papers between 2019 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

2019
2020
2021
2022
2023
2024
0
1
2
3
2
1

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2024
Novel accurate steady-state thermal resistance model for power chips embedded in TTSVs heat dissipation array.
Microelectron. J., 2024

Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon vias.
IEICE Electron. Express, 2024

2019
Translational Informatics for Parkinson's Disease: from Big Biomedical Data to Small Actionable Alterations.
Genom. Proteom. Bioinform., 2019


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