Zhongchen Bai
Orcid: 0000-0002-0286-4246
According to our database1,
Zhongchen Bai
authored at least 3 papers
between 2019 and 2024.
Collaborative distances:
Collaborative distances:
Timeline
2019
2020
2021
2022
2023
2024
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Bibliography
2024
Novel accurate steady-state thermal resistance model for power chips embedded in TTSVs heat dissipation array.
Microelectron. J., 2024
Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon vias.
IEICE Electron. Express, 2024
2019
Translational Informatics for Parkinson's Disease: from Big Biomedical Data to Small Actionable Alterations.
Genom. Proteom. Bioinform., 2019