Zhong Chen

Orcid: 0000-0001-7518-1414

Affiliations:
  • Nanyang Technological University, School of Materials Science and Engineering, Singapore


According to our database1, Zhong Chen authored at least 9 papers between 2009 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Bibliography

2024
Adaptive Fabrication of Electrochemical Chips with a Paste-Dispensing 3D Printer.
Sensors, May, 2024

2016
Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts.
Microelectron. Reliab., 2016

Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition.
Microelectron. Reliab., 2016

Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution.
Microelectron. Reliab., 2016

2014
Customized glass sealant for ceramic substrates for high temperature electronic application.
Microelectron. Reliab., 2014

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.
Microelectron. Reliab., 2014

2013
Simulation of bleeder flow and curing of thick composites with pressure and temperature dependent properties.
Simul. Model. Pract. Theory, 2013

2011
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution.
Microelectron. Reliab., 2011

2009
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages.
Microelectron. Reliab., 2009


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