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Zhong Chen

Orcid: 0000-0001-7518-1414

Affiliations:
  • Nanyang Technological University, School of Materials Science and Engineering, Singapore


According to our database1, Zhong Chen authored at least 9 papers between 2009 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

Online presence:

On csauthors.net:

Bibliography

2024
Adaptive Fabrication of Electrochemical Chips with a Paste-Dispensing 3D Printer.
[BibTeX]
[DOI]
Ten It Wong
,
Candy Ng
,
Shengxuan Lin
,
Zhong Chen
,
Xiaodong Zhou
Sensors, May, 2024

2016
Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts.
[BibTeX]
[DOI]
Vinod K. Murugan
,
Zhigang Jia
,
Govindo J. Syaranamual
,
Chee Lip Gan
,
Yizhong Huang
,
Zhong Chen
Microelectron. Reliab., 2016

Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition.
[BibTeX]
[DOI]
Adeline B. Y. Lim
,
Wei Jian Neo
,
Oranna Yauw
,
Bob Chylak
,
Chee Lip Gan
,
Zhong Chen
Microelectron. Reliab., 2016

Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution.
[BibTeX]
[DOI]
Adeline B. Y. Lim
,
Chris B. Boothroyd
,
Oranna Yauw
,
Bob Chylak
,
Chee Lip Gan
,
Zhong Chen
Microelectron. Reliab., 2016

2014
Customized glass sealant for ceramic substrates for high temperature electronic application.
[BibTeX]
[DOI]
Ahmed Sharif
,
Chee Lip Gan
,
Zhong Chen
Microelectron. Reliab., 2014

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.
[BibTeX]
[DOI]
Adeline B. Y. Lim
,
Andrew C. K. Chang
,
Oranna Yauw
,
Bob Chylak
,
Chee Lip Gan
,
Zhong Chen
Microelectron. Reliab., 2014

2013
Simulation of bleeder flow and curing of thick composites with pressure and temperature dependent properties.
[BibTeX]
[DOI]
A. S. Ganapathi
,
Sunil C. Joshi
,
Zhong Chen
Simul. Model. Pract. Theory, 2013

2011
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution.
[BibTeX]
[DOI]
H. Xu
,
C. Liu
,
Vadim V. Silberschmidt
,
Zhong Chen
,
J. Wei
,
M. Sivakumar
Microelectron. Reliab., 2011

2009
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages.
[BibTeX]
[DOI]
Xuefen Ong
,
Soon Wee Ho
,
Yue Ying Ong
,
Leong Ching Wai
,
Kripesh Vaidyanathan
,
Yeow Kheng Lim
,
David Yeo
,
Kai Chong Chan
,
Juan Boon Tan
,
Dong Kyun Sohn
,
Liang Choo Hsia
,
Zhong Chen
Microelectron. Reliab., 2009


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