Zhiyuan Yang

According to our database, Zhiyuan Yang authored at least 15 papers between 2016 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Exploring the Adversarial Frontier: Quantifying Robustness via Adversarial Hypervolume.

Ping Guo, Cheng Gong, Xi Lin, Zhiyuan Yang, Qingfu Zhang

CoRR, 2024

PuriDefense: Randomized Local Implicit Adversarial Purification for Defending Black-box Query-based Attacks.

Ping Guo, Zhiyuan Yang, Xi Lin, Qingchuan Zhao, Qingfu Zhang

CoRR, 2024

2020

DRAMsim3: A Cycle-Accurate, Thermal-Capable DRAM Simulator.

Shang Li, Zhiyuan Yang, Dhiraj Reddy, Ankur Srivastava, Bruce L. Jacob

IEEE Comput. Archit. Lett., 2020

2019

Enhanced Phase-Driven Q-Learning-Based DRM for Multicore Processors.

Zhiyuan Yang, Caleb Serafy, Tiantao Lu, Ankur Srivastava

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2019

2018

HMCTherm: a cycle-accurate HMC simulator integrated with detailed power and thermal simulation.

Zhiyuan Yang, Michael Zuzak, Ankur Srivastava

Proceedings of the International Symposium on Memory Systems, 2018

Value-driven Synthesis for Neural Network ASICs.

Zhiyuan Yang, Ankur Srivastava

Proceedings of the International Symposium on Low Power Electronics and Design, 2018

2017

TSV-Based 3-D ICs: Design Methods and Tools.

Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Sandeep Kumar Samal, Sung Kyu Lim, Ankur Srivastava

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017

Design Space Modeling and Simulation for Physically Constrained 3D CPUs.

Caleb Serafy, Zhiyuan Yang, Ankur Srivastava

Proceedings of the on Great Lakes Symposium on VLSI 2017, 2017

Phase-driven Learning-based Dynamic Reliability Management For Multi-core Processors.

Zhiyuan Yang, Caleb Serafy, Tiantao Lu, Ankur Srivastava

Proceedings of the 54th Annual Design Automation Conference, 2017

2016

Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks.

Caleb Serafy, Zhiyuan Yang, Ankur Srivastava, Yuanchen Hu, Yogendra Joshi

IEEE Des. Test, 2016

Post-Placement Optimization for Thermal-Induced Mechanical Stress Reduction.

Tiantao Lu, Zhiyuan Yang, Ankur Srivastava

Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2016

Electromigration-aware placement for 3D-ICs.

Tiantao Lu, Zhiyuan Yang, Ankur Srivastava

Proceedings of the 17th International Symposium on Quality Electronic Design, 2016

Voltage Noise Induced DRAM Soft Error Reduction Technique for 3D-CPUs.

Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Ankur Srivastava

Proceedings of the 2016 International Symposium on Low Power Electronics and Design, 2016

Physical Design of 3D FPGAs Embedded with Micro-channel-based Fluidic Cooling.

Zhiyuan Yang, Ankur Srivastava

Proceedings of the 2016 ACM/SIGDA International Symposium on Field-Programmable Gate Arrays, 2016

ECO Based Placement and Routing Framework for 3D FPGAs with Micro-fluidic Cooling.

Zhiyuan Yang, Caleb Serafy, Ankur Srivastava

Proceedings of the 24th IEEE Annual International Symposium on Field-Programmable Custom Computing Machines, 2016