Zhidong Xia

According to our database, Zhidong Xia authored at least 2 papers between 2009 and 2010.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2010

Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles.

Yaowu Shi, Yanfu Yan, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li

Microelectron. Reliab., 2010

2009

Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders.

Ruihong Zhang, Ran Zhao, Fu Guo, Zhidong Xia

Microelectron. Reliab., 2009