Zhenyang Chen

Orcid: 0009-0001-4949-6567

According to our database1, Zhenyang Chen authored at least 14 papers between 2013 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2024
Learning Prehensile Dexterity by Imitating and Emulating State-Only Observations.
IEEE Robotics Autom. Lett., October, 2024

Modeling and Online Calibration for SINS/CNS Asynchronous Time With NFOV Star Tracker.
IEEE Trans. Instrum. Meas., 2024

Catch It! Learning to Catch in Flight with Mobile Dexterous Hands.
CoRR, 2024

Learning Prehensile Dexterity by Imitating and Emulating State-only Observations.
CoRR, 2024

2023
In-Flight Calibration for Outer-Azimuth Dual-Axis RINS Based on Incremental Azimuth Observation Method.
IEEE Trans. Instrum. Meas., 2023

Efficient Belief Road Map for Planning Under Uncertainty.
CoRR, 2023

2022
A Personalized Pulmonary Circulation Model to Non-Invasively Calculate Fractional Flow Reserve for Artery Stenosis Detection.
IEEE Trans. Biomed. Eng., 2022

Bidirectional Sim-to-Real Transfer for GelSight Tactile Sensors With CycleGAN.
IEEE Robotics Autom. Lett., 2022

2021
Improved Rover Mobility Over Loose Deformable Slopes through Active Control of Body-Rotating Mechanism.
Proceedings of the 27th International Conference on Mechatronics and Machine Vision in Practice, 2021

Graph Attention Collaborative Similarity Embedding for Recommender System.
Proceedings of the Database Systems for Advanced Applications, 2021

2018
Deploy Large-Scale Deep Neural Networks in Resource Constrained IoT Devices with Local Quantization Region.
CoRR, 2018

2017
Dynamic data split: A crosstalk suppression scheme in TSV-based 3D IC.
Integr., 2017

2016
Video system for human attribute analysis using compact convolutional neural network.
Proceedings of the 2016 IEEE International Conference on Image Processing, 2016

2013
Modeling and analysis of signal transmission with Through Silicon Via (TSV) noise coupling.
Proceedings of the 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), 2013


  Loading...