Zheng Mei
Orcid: 0009-0004-1262-546X
According to our database1,
Zheng Mei
authored at least 7 papers
between 2004 and 2024.
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Bibliography
2024
Exploring Consumer Citizenship Behavior by Personification of E-Commerce Virtual Anchors Based on Shopping Value.
IEEE Access, 2024
2021
Mob. Inf. Syst., 2021
2017
Universal closed-form expression based on magnetic flux density for the inductance of Tapered Through-Silicon Vias (T-TSVs).
Microelectron. J., 2017
2016
New coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs).
IEICE Electron. Express, 2016
Universal closed-form expressions for the inductance of tapered through silicon vias (T-TSVs) based on vector magnetic potential.
IEICE Electron. Express, 2016
Proceedings of the Theory, Methodology, Tools and Applications for Modeling and Simulation of Complex Systems, 2016
2004
Proceedings of the Computational Linguistics and Intelligent Text Processing, 2004