Zhaowei Zhong

According to our database1, Zhaowei Zhong authored at least 16 papers between 2002 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2024
Quantum Error Corrected Fidelity Routing Design for Long-Distance Quantum Networks.
Proceedings of the International Conference on Computing, Networking and Communications, 2024

2023
A customer-centric IoT-based novel closed-loop supply chain model for WEEE management.
Adv. Eng. Informatics, January, 2023

2015
Nonlinearly enhanced vortex induced vibrations for energy harvesting.
Proceedings of the IEEE International Conference on Advanced Intelligent Mechatronics, 2015

2013
Correlation analysis of cutting force and acoustic emission signals for tool condition monitoring.
Proceedings of the 9th Asian Control Conference, 2013

2007
Dynamic responses and solder joint reliability under board level drop test.
Microelectron. Reliab., 2007

2006
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA.
Microelectron. Reliab., 2006

Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints.
Microelectron. Reliab., 2006

Huge Proteins in The Human Proteome and Their Participation in Hereditary Diseases.
Silico Biol., 2006

2004
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages.
Microelectron. Reliab., 2004

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis.
Microelectron. Reliab., 2004

Impact life prediction modeling of TFBGA packages under board level drop test.
Microelectron. Reliab., 2004

2003
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages.
Microelectron. Reliab., 2003

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications.
Microelectron. Reliab., 2003

Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill.
Microelectron. Reliab., 2003

Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn.
Int. J. Comput. Eng. Sci., 2003

2002
High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package.
Microelectron. Reliab., 2002


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