Zhao Chen
Orcid: 0000-0003-0579-0884Affiliations:
- Delft University of Technology, Electronic Instrumentation Laboratory, The Netherlands
According to our database1,
Zhao Chen
authored at least 12 papers
between 2015 and 2024.
Collaborative distances:
Collaborative distances:
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Bibliography
2024
A 2000-Volumes/s 3D Ultrasound Imaging Chip with Monolithically-Integrated 11.7×23.4mm<sup>2</sup> 2048-Element CMUT Array and Arbitrary-Wave TX Beamformer.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
Proceedings of the IEEE International Solid-State Circuits Conference, 2024
2019
A 1.54mW/Element 150μm-Pitch-Matched Receiver ASIC with Element-Level SAR/Shared-Single-Slope Hybrid ADCs for Miniature 3D Ultrasound Probes.
Proceedings of the 2019 Symposium on VLSI Circuits, Kyoto, Japan, June 9-14, 2019, 2019
2018
A Front-End ASIC With High-Voltage Transmit Switching and Receive Digitization for 3-D Forward-Looking Intravascular Ultrasound Imaging.
IEEE J. Solid State Circuits, 2018
IEEE J. Solid State Circuits, 2018
A Pitch-Matched Front-End ASIC With Integrated Subarray Beamforming ADC for Miniature 3-D Ultrasound Probes.
IEEE J. Solid State Circuits, 2018
A 0.91mW/element pitch-matched front-end ASIC with integrated subarray beamforming ADC for miniature 3D ultrasound probes.
Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018
2017
A Front-End ASIC With Receive Sub-array Beamforming Integrated With a 32 × 32 PZT Matrix Transducer for 3-D Transesophageal Echocardiography.
IEEE J. Solid State Circuits, 2017
A front-end ASIC with high-voltage transmit switching and receive digitization for forward-looking intravascular ultrasound.
Proceedings of the 2017 IEEE Custom Integrated Circuits Conference, 2017
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2017
2015
Proceedings of the 6th International Workshop on Advances in Sensors and Interfaces, 2015
Proceedings of the ESSCIRC Conference 2015, 2015