Zebin Kong

According to our database, Zebin Kong authored at least 1 paper in 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2021

The Relationship between Packaging Structures, Chip Area and Thermal Resistance of NMOS Semiconductor in Transient Dual Interface Method.

Fan Chen, Dapeng Liu, Long Chen, Shuai Tao, Jun You, Zebin Kong

Proceedings of the EITCE 2021: 5th International Conference on Electronic Information Technology and Computer Engineering, Xiamen, China, October 22, 2021