Yvonne Standke
According to our database1,
Yvonne Standke
authored at least 2 papers
between 2014 and 2018.
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Bibliography
2018
Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling.
Proceedings of the IEEE International Reliability Physics Symposium, 2018
2014
Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration.
Microelectron. Reliab., 2014