Yves Ousten

According to our database, Yves Ousten authored at least 20 papers between 2002 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2018

Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability.

M. Balmont, Isabelle Bord-Majek, B. Poupard, Laurent Béchou, Yves Ousten

Microelectron. Reliab., 2018

A new non-magnetic trimmer for the magnetic resonance imaging system.

Zaineb Jebri, Isabelle Bord-Majek, Celine Delafosse, Christophe Pasquet, Yves Ousten

Proceedings of the 7th International Conference on Modern Circuits and Systems Technologies, 2018

2015

Liquid Crystal Polymer for QFN packaging: Predicted thermo-mechanical fatigue and Design for Reliability.

Walide Chenniki, Isabelle Bord-Majek, Mélanie Louarn, Vincent Gaud, Jean-Luc Diot, Komkrisd Wongtimnoi, Yves Ousten

Microelectron. Reliab., 2015

Photothermal activated failure mechanism in polymer-based packaging of low power InGaN/GaN MQW LED under active storage.

Raphael Baillot, Yannick Deshayes, Yves Ousten, Laurent Béchou

Microelectron. Reliab., 2015

2013

Power MOSFET active power cycling for medical system reliability assessment.

Amadou Sow, Sinivassane Somaya, Yves Ousten, Jean-Michel Vinassa, Fanny Patoureaux

Microelectron. Reliab., 2013

2011

An original DoE-based tool for silicon photodetectors EoL estimation in space environments.

Piero Spezzigu, Laurent Béchou, Gianandrea Quadri, Olivier Gilard, Yves Ousten, Massimo Vanzi

Microelectron. Reliab., 2011

2010

Effects of silicone coating degradation on GaN MQW LEDs performances using physical and chemical analyses.

Raphael Baillot, Yannick Deshayes, Laurent Béchou, T. Buffeteau, I. Pianet, C. Armand, F. Voillot, S. Sorieul, Yves Ousten

Microelectron. Reliab., 2010

2008

Selective activation of failure mechanisms in packaged double-heterostructure light emitting diodes using controlled neutron energy irradiation.

Yannick Deshayes, Isabelle Bord-Majek, G. Barreau, M. Aiche, Philippe Moretto, Laurent Béchou, A. C. Roehrig, Yves Ousten

Microelectron. Reliab., 2008

Reliability investigations of 850 nm silicon photodiodes under proton irradiation for space applications.

M. L. Bourqui, Laurent Béchou, Olivier Gilard, Yannick Deshayes, Pamela Del Vecchio, L. S. How, F. Rosala, Yves Ousten, André Touboul

Microelectron. Reliab., 2008

2006

Defect detection in multilayer ceramic capacitors.

V. Krieger, Wolfgang Wondrak, A. Dehbi, W. Bartel, Yves Ousten, Bruno Levrier

Microelectron. Reliab., 2006

Use of signal processing imaging for the study of a 3D package in harsh environment.

Jean Augereau, Yves Ousten, Bruno Levrier, Laurent Béchou

Microelectron. Reliab., 2006

2005

Failure mechanisms and qualification testing of passive components.

H. A. Post, P. Letullier, T. Briolat, R. Humke, R. Schuhmann, K. Saarinen, W. Werner, Yves Ousten, G. Lekens, A. Dehbi

Microelectron. Reliab., 2005

Vibration lifetime modelling of PCB assemblies using steinberg model.

A. Dehbi, Yves Ousten, Yves Danto, Wolfgang Wondrak

Microelectron. Reliab., 2005

2004

Reliability of Low-Cost PCB Interconnections for Telecommunication Applications.

Geneviève Duchamp, Frédéric Verdier, Yannick Deshayes, François Marc, Yves Ousten, Yves Danto

Microelectron. Reliab., 2004

2003

An improved method for automatic detection and location of defects in electronic components using scanning ultrasonic microscopy.

Laurent Béchou, Dominique Dallet, Yves Danto, Pasquale Daponte, Yves Ousten, Sergio Rapuano

IEEE Trans. Instrum. Meas., 2003

Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuits.

G. Andriamonje, Vincent Pouget, Yves Ousten, Dean Lewis, Yves Danto, Jean-Michel Rampnoux, Younès Ezzahri, Stefan Dilhaire, Stéphane Grauby, Wilfrid Claeys

Microelectron. Reliab., 2003

2002

Behavioral study of passive components and coating materials under isostatic pressure and temperature stress conditions.

B. Trégon, Yves Ousten, Yves Danto, Laurent Béchou, Bernard Parmentier

Microelectron. Reliab., 2002

Evaluation of a micropackaging analysis technique by highfrequency microwaves.

Geneviève Duchamp, Yves Ousten, Yves Danto

Microelectron. Reliab., 2002

High temperature reliability testing of aluminum and tantalum electrolytic capacitors.

A. Dehbi, Wolfgang Wondrak, Yves Ousten, Yves Danto

Microelectron. Reliab., 2002

Acoustic analysis of an assembly: Structural identification by signal processing (wavelets).

Jean Augereau, Yves Ousten, Laurent Béchou, Yves Danto

Microelectron. Reliab., 2002