Yunna Sun

According to our database, Yunna Sun authored at least 2 papers between 2023 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system.

Yanan Tao, Chao Liang, Ziqi Mei, Zhiqiang Song, Yu Wu, Yunna Sun, Wenqiang Zhang, Yong Ruan, Xiaoguang Zhao

Microelectron. J., February, 2024

2023

Study on Complementary Auxiliary Cathode Method for Improving the Microstructure Uniformity of Electroplated Thick Metal Film.

Tan Yin, Yunna Sun, Yan Wang, Guifu Ding, Mingyu Zhang

Proceedings of the 18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2023