Yun Seop Yu

According to our database1, Yun Seop Yu authored at least 6 papers between 2006 and 2020.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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PhD thesis 
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Links

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Bibliography

2020
Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face Bonded 3D ICs.
Proceedings of the ISPD 2020: International Symposium on Physical Design, Taipei, Taiwan, March 29, 2020

2019
Tier Partitioning and Flip-flop Relocation Methods for Clock Trees in Monolithic 3D ICs.
Proceedings of the 2019 IEEE/ACM International Symposium on Low Power Electronics and Design, 2019

2016
Device Coupling Effects of Monolithic 3D Inverters.
J. Inform. and Commun. Convergence Engineering, 2016

General SPICE Modeling Procedure for Double-Gate Tunnel Field-Effect Transistors.
J. Inform. and Commun. Convergence Engineering, 2016

2014
Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs.
J. Inform. and Commun. Convergence Engineering, 2014

2006
A new multi-valued static random access memory (MVSRAM) with hybrid circuit consisting of single-electron (SE) and MOSFET.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2006), 2006


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