We stand with Ukraine  

Yun Chen

Orcid: 0000-0002-4988-8894

Affiliations:
  • Guangdong University of Technology, MOE, Key Laboratory of Mechanical Equipment Manufacturing and Control Technology, Guangzhou, China
  • Central South University, Changsha, China (PhD 2014)


According to our database1, Yun Chen authored at least 14 papers between 2012 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

Online presence:

On csauthors.net:

Bibliography

2024
Design and implementation of a precision levelling composite stage with active passive vibration isolation.
[BibTeX]
[DOI]
Lanyu Zhang
,
Shaoxuan Zhang
,
Jian Gao
,
Junhao Yi
,
Hao Wen
,
Yun Chen
,
Xin Chen
Robotics Comput. Integr. Manuf., 2024

2023
A High-Efficiency Searching Time Reduction Method for VCM Soft-Landing Operation During Chip Bonding.
[BibTeX]
[DOI]
Lanyu Zhang
,
Jian Gao
,
Yun Chen
,
Xin Chen
,
Yunbo He
IEEE Trans. Ind. Electron., September, 2023

A Novel Defocus-Degree-Based Phase Unwrapping and Fusion Algorithm for High-Speed and Large-Depth-Range 3D Measurement.
[BibTeX]
[DOI]
Zhuojun Zheng
,
Jian Gao
,
Lanyu Zhang
,
Xin Chen
,
Yun Chen
IEEE Trans. Ind. Electron., 2023

2021
A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging Process.
[BibTeX]
[DOI]
Lanyu Zhang
,
Jian Gao
,
Yunbo He
,
Xin Chen
,
Yun Chen
,
Hui Tang
,
Zhijun Yang
IEEE Trans. Ind. Electron., 2021

Intensity Modulated Gas RI Sensor Based on Inornate Antiresonant Hollow-Core Fiber With Ultrahigh Sensitivity.
[BibTeX]
[DOI]
Maoxiang Hou
,
Neng Wang
,
Jianguo Ma
,
Yun Chen
,
Xin Chen
IEEE Access, 2021

2020
Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging.
[BibTeX]
[DOI]
Yun Chen
,
Shuquan Ding
,
Junyu Long
,
Maoxiang Hou
,
Xin Chen
,
Jian Gao
,
Yunbo He
,
Ching-Ping Wong
IEEE Access, 2020

2019
Triangular Model Registration Algorithm Through Differential Topological Singularity Points by Helmholtz-Hodge Decomposition.
[BibTeX]
[DOI]
Dongqing Wu
,
Jian Gao
,
Zhengtao Xiao
,
Lanyu Zhang
,
Xin Chen
,
Hui Tang
,
Yun Chen
,
Yunbo He
IEEE Access, 2019

Dynamic Modeling, Simulation, and Experimental Verification of a Wafer Handling SCARA Robot With Decoupling Servo Control.
[BibTeX]
[DOI]
Yunbo He
,
Xiquan Mai
,
Chengqiang Cui
,
Jian Gao
,
Zhijun Yang
,
Kai Zhang
,
Xun Chen
,
Yun Chen
,
Hui Tang
IEEE Access, 2019

2018
Experimental and modeling study on viscosity of encapsulant for electronic packaging.
[BibTeX]
[DOI]
Xiuyang Shan
,
Yun Chen
Microelectron. Reliab., 2018

2017
A Rapid Vibration Reduction Method for Macro-Micro Composite Precision Positioning Stage.
[BibTeX]
[DOI]
Lanyu Zhang
,
Jian Gao
,
Xin Chen
,
Hui Tang
,
Yun Chen
,
Yunbo He
,
Zhijun Yang
IEEE Trans. Ind. Electron., 2017

A direct-drive SCARA robot for wafer&ceramic-substrate handling based on visual servoing.
[BibTeX]
[DOI]
Yunbo He
,
Chang Zhang
,
Wentao Ye
,
Zuoxiong He
,
Xin Chen
,
Jian Gao
,
Kai Zhang
,
Zhijun Yang
,
Xun Chen
,
Yun Chen
,
Hui Tang
Proceedings of the 2017 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, 2017

2016
Deep Learning-Based Model Reduction for Distributed Parameter Systems.
[BibTeX]
[DOI]
Mingliang Wang
,
Han-Xiong Li
,
Xin Chen
,
Yun Chen
IEEE Trans. Syst. Man Cybern. Syst., 2016

2012
Experiment study of dynamic looping process for thermosonic wire bonding.
[BibTeX]
[DOI]
Fuliang Wang
,
Yun Chen
,
Lei Han
Microelectron. Reliab., 2012

Modeling study of thermosonic flip chip bonding process.
[BibTeX]
[DOI]
Fuliang Wang
,
Yun Chen
Microelectron. Reliab., 2012


  Loading...