Yumi Kwon
According to our database1,
Yumi Kwon
authored at least 4 papers
between 2011 and 2019.
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Bibliography
2019
2012
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging.
Microelectron. Reliab., 2012
2011
Mechanical and wetting properties of epoxy resins: Amine-containing epoxy-terminated siloxane oligomer with or without reductant.
Microelectron. Reliab., 2011
Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs).
Microelectron. Reliab., 2011