Yuki Ohara

According to our database, Yuki Ohara authored at least 9 papers between 2009 and 2011.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2011

Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration.

Yuki Ohara, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs.

Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Yuki Ohara, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Temporary bonding strength control for self-assembly-based 3D integration.

Takafumi Fukushima, Yuki Ohara, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding.

Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack.

Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Heterogeneous integration technology for MEMS-LSI multi-chip module.

Kang Wook Lee, Shigeyuki Kanno, Yuki Ohara, Kouji Kiyoyama, Ji Chel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

A parallel ADC for high-speed CMOS image processing system with 3D structure.

Kouji Kiyoyama, Yuki Ohara, Kang Wook Lee, Y. Yang, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

3D integration technology for 3D stacked retinal chip.

Yoshiyuki Kaiho, Yuki Ohara, Hirotaka Takeshita, Kouji Kiyoyama, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration.

Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki, Hisashi Kino, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009