Yufeng Jin
Orcid: 0009-0006-9750-4599
According to our database1,
Yufeng Jin
authored at least 49 papers
between 2003 and 2024.
Collaborative distances:
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Bibliography
2024
TFIENet: Transformer Fusion Information Enhancement Network for Multimodel 3-D Object Detection.
IEEE Trans. Instrum. Meas., 2024
Proceedings of the 40th IEEE International Conference on Data Engineering, 2024
2023
Proceedings of the Thirty-Seventh AAAI Conference on Artificial Intelligence, 2023
2021
A clogging rate prediction model based on porous microarray membranes for liquid biopsies.
Proceedings of the 16th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2021
A Method for Automatic Counting and Labeling of Cells Stained with Microporous Membrane.
Proceedings of the 16th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2021
Proceedings of the International IEEE Joint Conference on Biometrics, 2021
2019
Proceedings of the 2019 IEEE International Conference on Real-time Computing and Robotics, 2019
Fabrication Process and Performance Analysis of AlN based Piezoelectric Micromachined Ultrasonic Transducer with a Suspended Structure.
Proceedings of the 14th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2019
Effect of Shared Cavity on Electromechanical Performance of Piezoelectric Based Micro-machined Ultrasonic Transducer Array.
Proceedings of the 14th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2019
Thermal Effect of PMUT and Its Application to the Heat Dissipation of Power Electronics.
Proceedings of the 14th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2019
2018
A Study on High Resolution Batch-Mode Micro-Utralsonic-Machining with Constant Feed Force of Sapphire for MEMS Application.
Proceedings of the 13th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2018
2017
An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias.
IEEE Trans. Very Large Scale Integr. Syst., 2017
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017
A method for high accuracy heading angle combined with ellipsoid calibration and BP neural network.
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017
Research of on-line modeling and real-time filtering for MEMS gyroscope random noise.
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017
High accuracy extend Kalman filter for posture measurement based on attitude and heading reference system.
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017
Optimization and simulation of satellite IMS access gateway and signal's propagation dela.
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017
Anemometer for detection of very low speed air flow with three-dimensional directionality.
Proceedings of the 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2017
Proceedings of the 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2017
2016
Thermal-mechanical reliability analysis of connection structure between redistribution layer and TSV for MEMS packaging.
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016
Fabrication and characterization of fine pitch TSV integration with self-aligned backside insulation layer opening.
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016
2015
Proceedings of the 2015 IEEE 11th International Conference on ASIC, 2015
Proceedings of the 2015 IEEE 11th International Conference on ASIC, 2015
Proceedings of the 2015 IEEE 11th International Conference on ASIC, 2015
2013
Electrical characterization of integrated passive devices using thin film technology for 3D integration.
J. Zhejiang Univ. Sci. C, 2013
Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration.
Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013
Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013
Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013
Proceedings of the Ninth International Conference on Intelligent Information Hiding and Multimedia Signal Processing, 2013
Proceedings of the IEEE 10th International Conference on ASIC, 2013
Proceedings of the Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, 2013
2012
Proceedings of the 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2012
2011
Proceedings of the 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2011
Proceedings of the 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2011
2010
A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge.
Proceedings of the 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2010
Proceedings of the 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2010
2009
Signal modulation schemes comparison in the telemetry unit for retinal prosthesis system.
Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009
Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009
Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009
Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration.
Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009
2008
Proceedings of the IEEE International Conference on Robotics and Biomimetics, 2008
Proceedings of the IEEE Asia Pacific Conference on Circuits and Systems, 2008
2003
Int. J. Comput. Eng. Sci., 2003