Yu Dian Lim
Orcid: 0000-0003-3111-488X
According to our database1,
Yu Dian Lim
authored at least 3 papers
between 2019 and 2024.
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Bibliography
2024
CoRR, 2024
2021
Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions.
Proceedings of the IEEE International 3D Systems Integration Conference, 2021
2019
Design Considerations and Fabrication Challenges of Surface Electrode Ion Trap with TSV Integration.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019