Youtaro Yasu

According to our database, Youtaro Yasu authored at least 1 paper in 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging.

Katsuya Kikuchi, Fumiki Kato, Shunsuke Nemoto, Hiroshi Nakagawa, Masahiro Aoyagi, Youtaro Yasu, Kohji Koshiji

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013