Youqi Ding

According to our database, Youqi Ding authored at least 3 papers between 2023 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2024

De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure.

O. Varela Pedreira, Youqi Ding, D. Coenen, Philippe Roussel, A. S. Saleh, Veerle Simons, Houman Zahedmanesh, Ivan Ciofi, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023

Challenges for Interconnect Reliability: From Element to System Level.

Olalla Varela Pedreira, Houman Zahedmanesh, Youqi Ding, Ivan Ciofi, Kristof Croes

Proceedings of the 2023 International Symposium on Physical Design, 2023

Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters.

Youqi Ding, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2023