Youngsun Oh

According to our database1, Youngsun Oh authored at least 9 papers between 2012 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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PhD thesis 
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Links

On csauthors.net:

Bibliography

2023
Automotive 2.1 μm Full-Depth Deep Trench Isolation CMOS Image Sensor with a 120 dB Single-Exposure Dynamic Range.
Sensors, November, 2023

An Indirect Time-of-Flight CMOS Image Sensor Achieving Sub-ms Motion Lagging and 60fps Depth Image from On-chip ISP.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

2022
A 1/1.33-inch 108Mpixel CMOS Image Sensor with 0.8um unit NONACELL pixels.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2022

2021
A 1.2-Mpixel Indirect Time-of-Flight Image Sensor With 4-Tap 3.5-μm Pixels for Peak Current Mitigation and Multi-User Interference Cancellation.
IEEE J. Solid State Circuits, 2021

A 4-tap 3.5 μm 1.2 Mpixel Indirect Time-of-Flight CMOS Image Sensor with Peak Current Mitigation and Multi-User Interference Cancellation.
Proceedings of the IEEE International Solid-State Circuits Conference, 2021

2020
5.6 A 1/2.65in 44Mpixel CMOS Image Sensor with 0.7µm Pixels Fabricated in Advanced Full-Depth Deep-Trench Isolation Technology.
Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020

2018
A 1/2.8-inch 24Mpixel CMOS image sensor with 0.9μm unit pixels separated by full-depth deep-trench isolation.
Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018

2014
7.1 A 1/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12μm pixel with front-side deep-trench isolation and vertical transfer gate.
Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014

2012
Sensitivity improvement in FSI CIS using the M1ToP™ smart process technique.
Proceedings of the International SoC Design Conference, 2012


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