Youngkwang Lee

Orcid: 0000-0002-0732-4716

According to our database1, Youngkwang Lee authored at least 7 papers between 2019 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

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Links

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Bibliography

2023
TSV Built-In Self-Repair Architecture for Improving the Yield and Reliability of HBM.
IEEE Trans. Very Large Scale Integr. Syst., April, 2023

Novel Error-Tolerant Voltage-Divider-Based Through-Silicon-Via Test Architecture.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2023

2022
Reduced-Pin-Count BOST for Test-Cost Reduction.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022

2021
A Circular-based TSV Repair Architecture.
Proceedings of the 18th International SoC Design Conference, 2021

Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC.
Proceedings of the 18th International SoC Design Conference, 2021

2020
Robust Secure Shield Architecture for Detection and Protection Against Invasive Attacks.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020

2019
Tunable Compact Probing Detector with Fast Analysis Time Against Invasive Attacks.
Proceedings of the 2019 International SoC Design Conference, 2019


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