Young-Doo Jeon

According to our database, Young-Doo Jeon authored at least 1 paper in 2006.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2006

Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages.

Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik

Microelectron. Reliab., 2006