Young-Chang Joo
Orcid: 0000-0003-2562-375X
According to our database1,
Young-Chang Joo
authored at least 7 papers
between 2008 and 2022.
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Bibliography
2022
Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape.
IEEE Access, 2022
2018
Computational paper wrapping transforms non-stretchable 2D devices into wearable and conformable 3D devices.
CoRR, 2018
Super Compaction and Pluripotent Shape Transformation via Algorithmic Stacking for 3D Deployable Structures.
CoRR, 2018
Successive breakdown mode of time-dependent dielectric breakdown for Cu interconnects and lifetime enhancement under dynamic bias stress.
Proceedings of the IEEE International Reliability Physics Symposium, 2018
2012
Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits.
Microelectron. Reliab., 2012
2011
Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices.
Proceedings of the BIODEVICES 2011, 2011
2008
The self-formatting barrier characteristics of Cu-Mg/SiO<sub>2</sub> and Cu-Ru/SiO<sub>2</sub> films for Cu interconnects.
Microelectron. Reliab., 2008