Yoshiharu Kariya

According to our database, Yoshiharu Kariya authored at least 2 papers between 2012 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via.

Kazuki Watanabe, Yoshiharu Kariya, Naoyuki Yajima, Kizuku Obinata, Yoshiyuki Hiroshima, Shunichi Kikuchi, Akiko Matsui, Hiroshi Shimizu

Microelectron. Reliab., 2018

2012

Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test.

Yoshihiko Kanda, Yoshiharu Kariya

Microelectron. Reliab., 2012