Yongping Lei
According to our database1,
Yongping Lei
authored at least 2 papers
between 2010 and 2018.
Collaborative distances:
Collaborative distances:
Timeline
2010
2011
2012
2013
2014
2015
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2018
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1
2
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Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2018
Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling.
Microelectron. Reliab., 2018
2010
Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles.
Microelectron. Reliab., 2010