Yongcong Wu

Orcid: 0000-0001-8256-718X

According to our database¹, Yongcong Wu authored at least 4 papers between 2019 and 2023.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of five.

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Bibliography

2023

Thermal Field Simulation and Analysis of Tulip Contact Based on Virtual Material Method.

[BibT_eX]

[DOI]

IEEE Access, 2023

Discussion on the Safe Distance Between HVDC Electrode and Pipeline.

[BibT_eX]

[DOI]

Yongcong Wu

Hansheng Cai

IEEE Access, 2023

2019

Optimum Methods of Thermal-Fluid Numerical Simulation for Switchgear.

[BibT_eX]

[DOI]

IEEE Access, 2019

Characteristics of the Flexible Graphite Grounding Material and its Engineering Application.

[BibT_eX]

[DOI]

IEEE Access, 2019

Yongcong Wu

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