Yong-Sung Eom

According to our database, Yong-Sung Eom authored at least 2 papers between 2017 and 2019.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2019

Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration.

Kwang-Seong Choi, Yong-Sung Eom, Seok Hwan Moon, Jiho Joo, Kwangjoo Lee, Jung Hak Kim, Ju Hyeon Kim

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2017

Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis.

Hyungseok Yoon, Kwang-Seong Choi, Hyun-Cheol Bae, Jong-Tae Moon, Yong-Sung Eom, Insu Jeon

Microelectron. Reliab., 2017