Yiyang Yan
According to our database1,
Yiyang Yan
authored at least 3 papers
between 2017 and 2022.
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Bibliography
2022
A Stress-Relieved Method Based on Bottom Pattern Design Considering Thermal and Mechanical Behavior of DBC Substrate.
IEEE Access, 2022
Proceedings of the IEEE Asia Pacific Conference on Circuit and Systems, 2022
2017
Proceedings of the 2017 IEEE International Conference on Software Quality, 2017