Yiu-Wing Mai

According to our database, Yiu-Wing Mai authored at least 3 papers between 2006 and 2015.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2015

Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints.

H. B. Qin, X. P. Zhang, M. B. Zhou, X. P. Li, Yiu-Wing Mai

Microelectron. Reliab., 2015

2009

The damped dynamics of printed circuit board and analysis of distorted and deformed half-sine excitation.

Ee-Hua Wong, Yiu-Wing Mai

Microelectron. Reliab., 2009

2006

New insights into board level drop impact.

Ee-Hua Wong, Yiu-Wing Mai

Microelectron. Reliab., 2006