Yipin Wu
According to our database1,
Yipin Wu
authored at least 3 papers
between 2007 and 2016.
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Bibliography
2016
Proceedings of the International Symposium on Integrated Circuits, 2016
2014
A novel power noise simulation methodology for chip design using Wafer Level Chip Scale Packaging.
Proceedings of the Technical Papers of 2014 International Symposium on VLSI Design, 2014
2007
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2007), 2007