Yinxiao Feng
Orcid: 0000-0002-3637-1132
According to our database1,
Yinxiao Feng
authored at least 6 papers
between 2022 and 2024.
Collaborative distances:
Collaborative distances:
Timeline
Legend:
Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2024
Evaluating Chiplet-based Large-Scale Interconnection Networks via Cycle-Accurate Packet-Parallel Simulation.
Proceedings of the 2024 USENIX Annual Technical Conference, 2024
Switch-Less Dragonfly on Wafers: A Scalable Interconnection Architecture based on Wafer-Scale Integration.
Proceedings of the International Conference for High Performance Computing, 2024
Proceedings of the 57th IEEE/ACM International Symposium on Microarchitecture, 2024
2023
Heterogeneous Die-to-Die Interfaces: Enabling More Flexible Chiplet Interconnection Systems.
Proceedings of the 56th Annual IEEE/ACM International Symposium on Microarchitecture, 2023
Proceedings of the IEEE International Symposium on High-Performance Computer Architecture, 2023
2022
Chiplet actuary: a quantitative cost model and multi-chiplet architecture exploration.
Proceedings of the DAC '22: 59th ACM/IEEE Design Automation Conference, San Francisco, California, USA, July 10, 2022