Yingtao Ding
According to our database1,
Yingtao Ding
authored at least 23 papers
between 2011 and 2022.
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Bibliography
2022
Coprime Nested Arrays for DOA Estimation: Exploiting the Nesting Property of Coprime Array.
IEEE Signal Process. Lett., 2022
Supplementary coprime array with enhanced DOFs exploiting hole filling strategy based on the difference and sum coarray.
Digit. Signal Process., 2022
Sci. China Inf. Sci., 2022
2021
Paper-based flexible broadband photodetectors functionalized by PbS quantum dots/Carbon nanotube networks hybrid structure.
Proceedings of the 2021 IEEE International Conference on Integrated Circuits, 2021
A Low-Cost and Low-Temperature Method to Realize Carbon Nanotube Conductor in Through-Silicon-Via.
Proceedings of the IEEE International 3D Systems Integration Conference, 2021
2020
IEEE Access, 2020
A Fully Integrated K-Band Dual Down-Conversion Receiver for Radar Applications in 90 nm CMOS.
IEEE Access, 2020
Coupled Thermo-Mechanical Analysis of 3D ICs Based on an Equivalent Modeling Methodology With Sub-Modeling.
IEEE Access, 2020
2019
Sampling and Reconstruction of Multiband Signals in Multiresolution Subspaces Associated With the Fractional Wavelet Transform.
IEEE Signal Process. Lett., 2019
1.15 GHz image rejection filter with 45 dB image rejection ratio and 8.4 mW DC power in 90 nm CMOS.
Microelectron. J., 2019
A 25-35 GHz 5-bit digital attenuator with low RMS amplitude error and low phase variation in 65 nm CMOS.
IEICE Electron. Express, 2019
A Fully Integrated 27.5-30.5 GHz 8-Element Phased-Array Transmit Front-end Module in 65 nm CMOS.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2019
Design and Evaluation of a Novel and Ultra-Compact Fully-TGV-based Self-Shielding Bandpass Filter for 5G Applications.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
2018
Sensors, 2018
A Novel Noncircular MUSIC Algorithm Based on the Concept of the Difference and Sum Coarray.
Sensors, 2018
2016
Temperature-aware multi-application mapping on network-on-chip based many-core systems.
Microprocess. Microsystems, 2016
Proceedings of the IEEE International Symposium on Circuits and Systems, 2016
Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
2015
Proceedings of the 2015 IEEE 11th International Conference on ASIC, 2015
Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2014
Sensors, 2014
Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner.
Microelectron. Reliab., 2014
2011
Int. J. Comput. Intell. Syst., 2011