Ying-Chih Liao

According to our database, Ying-Chih Liao authored at least 6 papers between 2019 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

A Multimodality Electrochemical and Impedance Spectroscopy System-on-a-Chip With Temperature Sensing and Impedance-Boosting Techniques.

Yi-Jie Lin, Wei-Cheng Liu, Yu-Chiao Huang, Ying-Jie Huang, Yung-Hua Yeh, Min-Hua Chang, Shu-Ping Lin, Ying-Chih Liao, Yu-Te Liao

IEEE Trans. Biomed. Circuits Syst., August, 2023

An Electrical Impedance Spectroscopy IC with a Printable, Fractal Root Textile Sensor for Perspiration Analysis.

Yung-Hua Yeh, Wei-Cheng Liu, Yi-Jie Lin, Yu-Siang Chou, Yu-Chiao Huang, Min-Hua Chang, I-Te Lin, Yen-Chi Chen, Ying-Chih Liao, Yu-Te Liao

Proceedings of the 49th IEEE European Solid State Circuits Conference, 2023

2022

A Wireless Soil pH and Conductance Monitoring Chip Powered by Soil Microbial and Photovoltaic Energy Cells.

Ting-Heng Lu, Chi-Wei Liu, Chuan-Yi Wu, Cong-Sheng Huang, Jing-Siang Chen, Ling-Chia Chen, Yao-Wei Huang, I-Che Ou, Sook-Kuan Lee, Yen-Chi Chen, Po-Hung Chen, Chi-Te Liu, Ying-Chih Liao, Yu-Te Liao

IEEE Trans. Biomed. Circuits Syst., December, 2022

A Self-powering Wireless Soil-pH and Electrical Conductance Monitoring IC with Hybrid Microbial Electrochemical and Photovoltaic Energy Harvesting.

Chuan-Yi Wu, Chi-Wei Liu, Jing-Siang Chen, Cong-Sheng Huang, Ting-Heng Lu, Ling-Chia Chen, I-Che Ou, Sook-Kuan Lee, Yen-Chi Chen, Po-Hung Chen, Chi-Te Liu, Ying-Chih Liao, Yu-Te Liao

Proceedings of the IEEE International Solid-State Circuits Conference, 2022

2020

Photo-Curable Ion-Enhanced Fluorinated Elastomers for Pressure-Sensitive Textiles.

Guan-Ting Chen, Chun-Hao Su, Shih-Han Wei, Tien-Lin Shen, Pei-Hsuan Chung, Qiao-Miao Guo, Wei-Jen Chen, Yang-Fang Chen, Ying-Chih Liao, Wen-Ya Lee

Adv. Intell. Syst., 2020

2019

Wirelessly-Powered Printed Temperature Sensor with an Ultra-Low-Power and High-Sensitivity CMOS Readout IC.

Shao-Yung Lu, I-Feng Wu, Ying-Chih Liao, Yu-Te Liao

Proceedings of the 17th IEEE International New Circuits and Systems Conference, 2019