Yi-Wei Tseng

According to our database, Yi-Wei Tseng authored at least 2 papers in 2015.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2015

Effect of annealing on the microstructure and bonding interface properties of Ag-2Pd alloy wire.

Yi-Wei Tseng, Fei-Yi Hung, Truan-Sheng Lui, Mei-Yu Chen, Hao-Wen Hsueh

Microelectron. Reliab., 2015

Microstructure, tensile and electrical properties of gold-coated silver bonding wire.

Yi-Wei Tseng, Fei-Yi Hung, Truan-Sheng Lui

Microelectron. Reliab., 2015