Yi-Shao Lai
According to our database1,
Yi-Shao Lai
authored at least 55 papers
between 1993 and 2015.
Collaborative distances:
Collaborative distances:
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Bibliography
2015
Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption.
Microelectron. Reliab., 2015
Microelectron. Reliab., 2015
2014
Microelectron. Reliab., 2014
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages.
Microelectron. Reliab., 2014
2013
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile.
Microelectron. Reliab., 2013
2012
Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging.
Microelectron. Reliab., 2012
Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints.
Microelectron. Reliab., 2012
Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages.
Microelectron. Reliab., 2012
The performance and fracture mechanism of solder joints under mechanical reliability test.
Microelectron. Reliab., 2012
A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation.
Microelectron. Reliab., 2012
2011
Evaluating nanotribological behavior of annealing Si<sub>0.8</sub>Ge<sub>0.2</sub>/Si films.
Microelectron. Reliab., 2011
Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA.
Microelectron. Reliab., 2011
Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes.
Microelectron. Reliab., 2011
Microelectron. Reliab., 2011
Warpage evolution of overmolded ball grid array package during post-mold curing thermal process.
Microelectron. Reliab., 2011
Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding.
Microelectron. Reliab., 2011
Microelectron. Reliab., 2011
2010
Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package.
Microelectron. Reliab., 2010
Effect of annealing treatment and nanomechanical properties for multilayer Si<sub>0.8</sub>Ge<sub>0.2</sub>-Si films.
Microelectron. Reliab., 2010
Microelectron. Reliab., 2010
Redistribution in wafer level chip size packaging technology for high power device applications: Process and design considerations.
Microelectron. Reliab., 2010
Geometric design for ultra-long needle probe card for digital light processing wafer testing.
Microelectron. Reliab., 2010
2009
Microelectron. Reliab., 2009
High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys.
Microelectron. Reliab., 2009
Microelectron. Reliab., 2009
Towards elastic anisotropy and strain-induced void formation in Cu-Sn crystalline phases.
Microelectron. Reliab., 2009
2008
Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops.
Microelectron. Reliab., 2008
Microelectron. Reliab., 2008
Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions.
Microelectron. Reliab., 2008
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages.
Microelectron. Reliab., 2008
Finite element model verification for packaged printed circuit board by experimental modal analysis.
Microelectron. Reliab., 2008
Effects of different drop test conditions on board-level reliability of chip-scale packages.
Microelectron. Reliab., 2008
2007
Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition.
Microelectron. Reliab., 2007
Empirical correlation between package-level ball impact test and board-level drop reliability.
Microelectron. Reliab., 2007
Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses.
Microelectron. Reliab., 2007
Microelectron. Reliab., 2007
Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages.
Microelectron. Reliab., 2007
Microelectron. Reliab., 2007
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy.
Microelectron. Reliab., 2007
2006
Evaluation of board-level reliability of electronic packages under consecutive drops.
Microelectron. Reliab., 2006
Transient fracturing of solder joints subjected to displacement-controlled impact loads.
Microelectron. Reliab., 2006
Microelectron. Reliab., 2006
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition.
Microelectron. Reliab., 2006
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages.
Microelectron. Reliab., 2006
Microelectron. Reliab., 2006
On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials.
Microelectron. Reliab., 2006
2005
Microelectron. Reliab., 2005
Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly.
Microelectron. Reliab., 2005
1993
An Observation on Fractal Characteristics of Individual River Plan Forms.
Proceedings of the Fractals in the Natural and Applied Sciences, 1993