Yi-Chieh Tsai

According to our database, Yi-Chieh Tsai authored at least 2 papers in 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2019

Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology.

Yi-Chieh Tsai, Chia-Hsuan Lee, Kuan-Neng Chen

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer.

Demin Liu, Po-Chih Chen, Yi-Chieh Tsai, Kuan-Neng Chen

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019