Yasumitsu Orii

According to our database, Yasumitsu Orii authored at least 12 papers between 2004 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Semiconductor Packaging Revolution in the Era of Chiplets : Keynote 1.

Yasumitsu Orii

Proceedings of the IEEE International Test Conference in Asia, 2023

Semiconductor Packaging Revolution in the Era of Chiplets.

Yasumitsu Orii

Proceedings of the International Conference on IC Design and Technology, 2023

2020

Molecular Inverse-Design Platform for Material Industries.

Seiji Takeda, Toshiyuki Hama, Hsiang-Han Hsu, Victoria A. Piunova, Dmitry Zubarev, Daniel P. Sanders, Jed W. Pitera, Makoto Kogoh, Takumi Hongo, Yenwei Cheng, Wolf Bocanett, Hideaki Nakashika, Akihiro Fujita, Yuta Tsuchiya, Katsuhiko Hino, Kentaro Yano, Shuichi Hirose, Hiroki Toda, Yasumitsu Orii, Daiju Nakano

Proceedings of the KDD '20: The 26th ACM SIGKDD Conference on Knowledge Discovery and Data Mining, 2020

2019

An Information Extraction and Knowledge Graph Platform for Accelerating Biochemical Discoveries.

Matteo Manica, Christoph Auer, Valéry Weber, Federico Zipoli, Michele Dolfi, Peter W. J. Staar, Teodoro Laino, Costas Bekas, Akihiro Fujita, Hiroki Toda, Shuichi Hirose, Yasumitsu Orii

CoRR, 2019

2015

Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration.

Kuniaki Sueoka, Akihiro Horibe, T. Aoki, Sayuri Kohara, Kazushige Toriyama, Hiroyuki Mori, Yasumitsu Orii

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack.

Keiji Matsumoto, Hiroyuki Mori, Yasumitsu Orii

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack.

Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi, Hiroyuki Mori, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara, Junichi Takamatsu, Koji Kondo

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Thermo-mechanical evaluation of 3D packages.

Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Hiroyuki Mori, Yasumitsu Orii

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration.

Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Yasumitsu Orii, Katsuyuki Sakuma, Takahiro Kinoshita, Takashi Kawakami

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package.

Toru Ikeda, Masatoshi Oka, Shinya Kawahara, Noriyuki Miyazaki, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

High density 3D integration by pre-applied Inter Chip Fill.

Akihiro Horibe, Kuniaki Sueoka, Katsuyuki Sakuma, Sayuri Kohara, Keiji Matsumoto, Hidekazu Kikuchi, Yasumitsu Orii, Toshiro Mitsuhashi, Fumiaki Yamada

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2004

Solder joint reliability evaluation of chip scale package using a modified Coffin-Manson equation.

Ikuo Shohji, Hideo Mori, Yasumitsu Orii

Microelectron. Reliab., 2004