Yasuhiro Kitamura
According to our database1,
Yasuhiro Kitamura
authored at least 4 papers
between 2011 and 2015.
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Bibliography
2015
Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2013
Proceedings of the HCI International 2013 - Posters' Extended Abstracts, 2013
2012
A hybrid structured turbo code of CBRM in conjunction with XOR coded parity compression.
Proceedings of the International Symposium on Information Theory and its Applications, 2012
2011
PDN impedance analysis of TSV-decoupling capacitor embedded Silicon interposer for 3D-integrated CMOS image sensor system.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011