Yann Lamy

According to our database, Yann Lamy authored at least 2 papers between 2013 and 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2014

Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer.

Khadim Dieng, Philippe Artillan, Cédric Bermond, Olivier Guiller, Thierry Lacrevaz, Sylvain Joblot, Gregory Houzet, Alexis Farcy, Yann Lamy, Bernard Fléchet

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Which interconnects for which 3D applications? Status and perspectives.

Yann Lamy, Jean-Philippe Colonna, G. Simon, Patrick Leduc, Séverine Cheramy, C. Laviron

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013